![]() FLOOR, CEILING OR WALL ELEMENT
专利摘要:
A floor, ceiling or wall element for a heatable and / or coolable floor, ceiling or wall structure, with receiving spaces for receiving heating and / or cooling tubes (5) has a first layer with spaced apart side by side boards (1) and a second layer having spaced apart boards (2) extending transversely to the extent of the boards (1) of the first layer and connected to the boards (1) of the first layer. The intermediate spaces (4) located between the boards (2) of the second layer form the receiving spaces for the heating and / or cooling pipes (5). The intermediate spaces (4) enclosing narrow sides of the boards (2) of the second layer and the boards (1) of the first layer directed away from the tops of the boards (2) of the second layer have a coating (6, 7) with a heat-conducting Material on. 公开号:AT510499A1 申请号:T1681/2010 申请日:2010-10-08 公开日:2012-04-15 发明作者:Hans Loss 申请人:Hans Loss; IPC主号:
专利说明:
• Patent Attorneys HefelS (Hofmann 23659/33 / ss 100927) patent attorneys European Patent Attorneys European Trademark Attorneys Dl Herbert Hefel (until 2006) Dr. Ralf Hofmann Thomas Fechner 6806 Feldkirch, Austria Egelseestr 65a, PO Box 61 1 The invention relates to a floor, ceiling or wall element for a heating and / or coolable floor, ceiling or wall construction, with receiving spaces for receiving heating and / or cooling pipes. Furthermore, the invention relates to a heatable and / or coolable floor, ceiling or wall construction comprising such an element. Elements for receiving heating and / or cooling pipes in heatable and / or coolable floor, wall or ceiling constructions are known in different embodiments. For example, profiled building boards with formed on the top, parallel grooves are known, which form the receiving spaces for inserting the heating and / or cooling pipes. Such a building board is for example from DE 100 49 172 A1. A problem with such building panels, especially if they are made of a poor thermal conductivity material, is in the heat distribution, especially if not each of the grooves of the building board is covered with a pipe. The heat flow is then mainly in the direction of the arranged on the plates, for example, formed by a prefinished flooring, the thickness of which is relatively low. The result is that there are stripe-shaped areas of the floor covering which are more heated and in which the temperature is higher than in strips lying between them. However, this reduces the radiating heating surface, which reduces efficiency. In addition, there may be adverse effects on the floor covering, in particular for the formation of discolored strips. The same applies to the heating as for the heating. In another conventional floor structure of a floor heating a Styrofoam plate is provided with grooves formed therein. In this U-profiles made of metal are used, in which in turn the heating pipes are used. Above this, a sheet metal plate is placed and above it a sufficiently thick pressure-stable layer, which is formed, for example, by plasterboards. If necessary, contact T +43 (0) 5522 73 137 F i43 (0) 5522 73 359 M office@vpat.at I www.vpat.at VAT ATU 65652215 Bank details Österreichische Postsparkasse Sparkasse of the city of Feldkirch Account No. 92.111.622, bank code 60000 Account No. 0400-006300, bank code 20604 Swift-Code: OPSKATWW Swift-Code: SPFKAT2B IBAN: AT55 6000 0000 9211 1622 IBAN: AT70 2060 4004 0000 6300 • * «* ·« • · · · · · 4 •% * ·· # ^ * * * Interposition of suitable films or mats laid the flooring. A disadvantage here is that increases the height of the entire floor structure by the intermediate pressure-stable layer. Furthermore, the system becomes much sluggish through this intermediate layer. The object of the invention is to enable a heatable and / or coolable floor, ceiling or wall construction, in which at a low height effective heat distribution is made possible. According to the invention, this is achieved by a floor, ceiling or wall element with the features of claim 1 or by such elements having floor, ceiling or wall structure. In a floor, ceiling or wall element according to the invention, a first layer with spaced side by side boards is present. The boards of this first layer are connected to spaced-apart boards of a second layer, the boards of the second layer lying transversely, preferably at right angles, to the boards of the first layer. The superimposed boards of the two layers are thus arranged intersecting or grid-shaped and connected to each other at intersection points, preferably at all crossing points. These connections can advantageously be formed by nailing or screwing. In this way, a supporting structural element can be formed, wherein the receiving spaces or receiving channels for receiving the heating and / or cooling tubes are formed by the gaps lying between the boards of the second layer. The intermediate spaces between enclosing narrow sides of the boards of the second layer, which thus define the receiving spaces for the heating and / or cooling pipes are coated with a thermally conductive material. Furthermore, the upper sides of the boards of the second layer directed away from the boards of the first layer are coated with a thermally conductive material, preferably with the same thermally conductive material as the narrow sides of the boards. If a heating and / or cooling pipe is inserted into a space between two boards, this heat-conductive coating improves the heat transport from the edge areas of the boards adjacent to the heating and / or cooling pipe to middle areas of these boards. «• "* Depending on the circumstances, in particular depending on the required heating power, heating and / or cooling tubes are used in all existing between boards of the second layer spaces and only in a part of these spaces, for example in every second or every third space. If there are gaps between boards of the second layer without heating and / or cooling pipes used, then a heat flow to these free spaces between boards of the second layer takes place through the spaces between the boards of the first layer (as explained in more detail below). In this case, the heat transport is again improved by the coating with the heat-conducting material from the remaining free spaces of the second layer to middle regions of the boards adjoining these remaining free spaces. Overall, an element is provided in which at a low height efficient distribution of the introduced heat is achieved. An inventive floor, ceiling or wall element can vorteiihafterweise represent a supporting part of the construction. For example, the element may be attached to spaced carriers, e.g. be mounted on spaced beams of a beam ceiling, and span the distance between these beams. This also leads to an overall low construction, as it is particularly advantageous for example in Althaussanierungen. Also material savings can be achieved. An inventive floor, ceiling or wall element advantageously has a simple and inexpensive construction. The heat-conductive coating preferably contains graphite, particularly preferably with a weight fraction of at least 50%. As binding material may conveniently be provided a water glass, in particular soda-water glass. Graphite has a high thermal conductivity which far exceeds that of steel. A plot is possible for example by a dipping process. Further advantages and details of the invention are explained below with reference to the attached drawing: In which: * * * t < »· **« φ »* · · · ·» Fig. 1 is a perspective view of a floor, ceiling or wall element according to the invention; Figure 2 is a schematic cross-section through a bottom structure with the element shown in Figure 1, the element being cut along the line AA of Figure 1; 3 shows an enlarged detail B of FIG. 2 (the coatings of the boards are not shown to scale here); Fig. 4 is an oblique view of a portion of the element of Fig. 1 (one of the boards of the upper layer is shown partially broken away) with inserted heating and / or cooling tubes. The inventive element shown in Fig. 1 has parallel to each other aligned boards 1 a first layer and these boards 1 crossing boards 2 a second layer, which are also aligned parallel to each other. The boards 1 of the first layer lie in a common first plane and the boards 2 of the second layer are in a common second plane parallel thereto. The boards 2 of the second layer are on the boards 1 of the first layer and are connected at intersections with these, preferably at all crossing points. The connection can be formed in an advantageous manner by means of nails or screws. Adjacent boards 1 of the first layer each have a gap 3 between them. Adjacent boards 2 of the second layer each have a gap 4 between them. Overall, a planar element is formed, i. its width b (measured in the direction of the longitudinal extent of the boards 1) and its length l (measured in the direction of the longitudinal extent of the boards 2) are substantially larger, preferably more than ten times larger than the total thickness d of the element (at right angles to the planes the first and second boards measured). The total thickness d of the element is preferably less than 50 mm, more preferably less than 40 mm. The width b may be, for example, in the range of 500mm to 2000mm. The length I can be, for example, in the range of 500mm to 2000mm. The criss-cross nailing or bolted boards form a tarpaulin, warp-free and stable plate. The interspaces 4 between the boards 2 are used for inserting heating and / or cooling tubes 5 (see Fig. 2 to 4), as will be explained in more detail below. The gaps 3 between the boards 1 are used for heat distribution, as also explained in more detail below. The boards 1, 2 are preferably formed of wood, such as spruce wood. Other materials for the formation of the boards 1 and / or 2 are conceivable and possible, for example, a design of chipboard, OSB boards or plastic, in particular unfoamed plastic in order to achieve sufficient compressive strength. The intermediate spaces 4 between them enclosing narrow sides (= side surfaces) of the boards 2 of the second layer have a coating 6 of a thermally conductive material. The upper sides (^ surfaces) of the boards 2 of the second layer directed away from the boards 1 of the first layer likewise have a coating 7 with a thermally conductive material, preferably the same thermally conductive material. In the exemplary embodiment shown, all free surfaces of the boards 1, 2, ie all areas of their surfaces in which they do not abut each other, are coated with this heat-conducting material. In Fig. 3 in this case the coating 8 on the underside of one of the boards 1 of the first layer can be seen. The thermally conductive material forming the respective coating 6, 7, 8 preferably contains graphite in combination with a binding agent and / or a solvent. Preferably, the graphite content in the finished coating 6, 7, 8 (after volatilization of the solvent) is more than 50% by weight. The proportion by weight is particularly preferably in the range from 70% by weight to 90% by weight of the heat-conducting material. The preparation of the heat-conducting material to be applied may contain water as solvent, which evaporates after application. As a binder, the heat-conductive material may advantageously contain water glass, in particular soda-water glass, which is liquid and water-soluble. In the preparation of the preparation, the powdered graphite, binder and solvent (which may be present in the binder) and optionally further additives are mixed. The application of the thermally conductive material can be done for example in a dipping process. Here, the still uncoated element is immersed in a flowable preparation of the thermally conductive material containing dip tank, for example, ahead with the boards 2 of the second layer, and dried after draining excess heat conductive material. Due to the consistency of the heat-conducting material, which can be adjusted by the proportion of solvent, the desired layer thickness of the coating 6, 7, 8 can be achieved. Other types of application are possible, for example by painting or by spraying (possibly several times). The thickness of the coating 6, 7 of the interspaces 4 einschießenden side surfaces of the boards 2 and directed away from the boards 1 tops of the boards 2 is preferably at least 0.5mm. The boards 2 and the boards 1 are perpendicular to each other with their longitudinal extent. Deviations from this orthogonal arrangement in the range of +/- 30 ° are conceivable and possible (such orientations are still referred to in this document as "transverse" to each other). At each opposite edges of the element stand on one side of the boards 1, on the other side of the boards 2 on the boards of the other position on. It thereby enables a beneficial overlapping connection of adjacent elements, also referred to as a Z-connection. In the region of the overlap, the elements can be connected to one another, for example screwed or nailed. In Fig. 2 such formed in the form of screws or nails fasteners 9 are indicated by dashes. After the areal laying of the elements over the area of the trainees Bo-denaufbaus or ceiling structure or wall structure, the heating and / or cooling tubes 5 are inserted into the desired interstices 4. In this case, each of the intermediate spaces 4 may be occupied by a heating and / or cooling pipe or partial occupancies may be provided, for example an occupancy of each second intermediate space 4 (as shown in FIG. 2) or every third interspace 4. The occupancy depends in particular on the desired heating power or cooling capacity. The thickness and type of the coating 10 can also have an influence. * 7 " The extending through the interstices 4 sections of the tubes 5 are connected in a conventional manner by adjacent to the elements extending, in particular arcuate, sections with each other (not shown in the figures). The heating and / or cooling tubes 5 are in the inserted state to the provided with the coating 6 narrow sides of the respective gap 4 bounding boards 2, in order to achieve a good heat transfer. Advantageously, the tubes 5 are somewhat clamped in the spaces 4, so that they are held frictionally in the spaces 4. The measured in the direction perpendicular to the longitudinal extent of the boards 2 width B of the interstices 4 is this conveniently at least 1 mm smaller than the undeformed outer diameter of the tubes 5. For example, the width B may be 14mm and the outer diameter of the tubes 16mm. Other widths of the interstices 4 and outer diameter of the tubes 5 may be provided, for example, the outer diameter of the inserted tubes 5 may be in the range of 12mm to 25mm. As heating and / or cooling pipes 5 preferably aluminum composite pipes are used. Such aluminum composite pipes are known and customary for heating and / or coolable floor, ceiling or wall constructions. The heat flow (in the case of training as a heater) is indicated schematically in Fig. 4 by arrows. From the pipe 5 inserted into a respective intermediate space 4, heat is transferred from the coatings 6 of the narrow sides of the boards 2 enclosing the intermediate space 4 between them to the coating 7 of the upper side of these boards 2. From the coating 7 heat is conducted from the edge region of the respective board 2 to a central region of the board 2. Furthermore, heat is conducted from the tube 5 through the intermediate spaces 3 located under a respective tube 5 between the boards 1 of the first layer. The heat passes through these spaces 3 also to the not occupied with tubes 5 spaces 4 between boards 2 of the second layer, see. 4 and through these interspaces 4 and over the coatings 6, 7 from the edge regions of the boards 2 adjoining the empty interspaces 4 to the middle regions of these boards 2. II. · * T A «· III« · * • I ·· «« * * * Φ · ····· · · · * * · g * · ·· * * · The element according to the invention thus contains a type of hypocaust, which is formed by the arrangement of the boards 1 of the first layer. In addition, of course, a certain heat flow through the base material of the boards 2, 1 instead. In the area of the intermediate spaces 3 between the boards 1, the undersides of the boards 2 of the second layer facing the intermediate spaces 3 are also coated with the heat-conducting material. These coatings also support the heat transfer. The heat distribution thus takes place with the aid of the heat-conducting coatings and is supported by the formed hypocausts. Overall, there is a good distribution of the heat given off over the tops of the boards 2, so that the heat from there can be discharged relatively evenly to the covering 10 (via any layers 11 therebetween). The same applies to the heat to be absorbed by the covering 10 in the case of the formation of a coolable floor, ceiling or wall structure, The widths C measured in the direction perpendicular to the longitudinal extent of the boards 1 between the spaces 3 between the boards 1 of the first layer are preferably at least 60 mm. The width of the boards 1 may be, for example, in the range of 60mm to 180mm. The width of the boards 2 may for example be in the range of 30mm to 90mm. The thicknesses of the boards 1, 2 may for example be in the range of 12mm to 25mm, wherein the boards 1 may also have a different thickness than the boards 2. In the exemplary embodiment, the boards 1 and the boards 2 are each 16mm thick. The elements formed by the boards 1, 2, which have the coatings are formed as load-bearing elements of a floor, ceiling or wall structure. It can be formed by advantageous constructions. *: • t:: :: • ♦ · · · ► * An example of a floor structure with elements according to the invention is shown in Fig. 2, The elements are mounted on supports 12, for example by screwing or nailing, The support 12 are formed by beams of a wooden beam ceiling. The elements each span adjacent supports 12 cantilevered and thus have a supporting function, First, the elements are laid over the entire area of the trainee floor structure and fastened to each other with fasteners 9. As a result, the heating and / or cooling tubes 5 are inserted into the corresponding intermediate spaces 4. The covering 10 is arranged on the elements occupied by the heating and / or cooling tubes 5, if appropriate with the interposition of one or more layers 11. The total thickness of such intermediate layers 11 is as small as possible; this is advantageously at least less than half the thickness of the covering 10. In addition to a small total thickness of the construction, a low inertia of the heating and / or cooling system can be achieved in this case. The layer 11 can be formed, for example, by a nonwoven mat or a cork mat. For example, the covering 10 may be a ready-made parquet, which is laid floating on a sound-absorbing mat forming the layer 11. Instead, a covering 10, which is formed for example of tiles, could be glued directly to the coated tops of the boards 2. Between supports 12, an insulation 13 is shown in Fig. 2. In an analogous manner, a wall structure can be formed with elements according to the invention. For example, the elements can be attached to angled rails. As a coating 10, e.g. a be applied by means of a mounted on the tops of the boards 1 plaster carrier plaster. Tiles can be glued for example as a covering. One or both opposite wall surfaces may be formed in this way, wherein between the two-sided elements, a corresponding insulation may be arranged. • · • Μ Sn analogous way, a ceiling structure can be formed. For example, the elements 1 may be attached to wooden beams of the ceiling. As a covering, for example, a plaster applied by means of a plaster carrier can be provided. The covering could be formed in the training as a wall or ceiling construction of plasterboard or include these. In order to be able to form a good bond with the top side of the boards 2 having the coating 7, these coated top sides are preferably rough. For this purpose, unpolished boards can be used favorably, on the tops of which the coating 7 is applied. A thermally conductive material could also be formed on other basis than graphite, for example on the basis of metal powder. Mixtures of different thermally conductive base materials could also be present in the heat-conducting material. 11 • * * * I Key to the reference numbers: 1 board 2 board 3 space 4 space 5 heating and / or cooling pipe 6 coating 7 coating 8 coating 9 connecting element 10 covering 11 layer 12 carrier 13 insulation
权利要求:
Claims (9) [1] • I • I Patent Attorneys HefelSiHofmann 23659/33 / ss 100927 Patent Attorneys Euröpeah Patent Attorneys European Trademark Attorneys Dl Herbert Hefel (until 2006) Ralf Hofmann Thomas Fechner 6806 Feldkirch, Austria Egelseestr 65a, PO Box 6 '1. Floor, ceiling or wall element for a heatable and / or coolable floor, ceiling or wall construction, with receiving spaces for receiving heating and / or cooling pipes ( 5), characterized in that the floor, ceiling or Wandele element has a first layer with spaced apart side by side boards (1) and a second layer with spaced juxtaposed boards (2) extending transversely to the extension of the boards ( 1) of the first layer and are connected to the boards (1) of the first layer, wherein the between the boards (2) of the second layer lying intermediate spaces (4) form the receiving spaces for the heating and / or cooling tubes (5), and that the intermediate spaces (4) between them enclosing narrow sides of the boards (2) of the second layer as well as the boards (1) directed away from the first layer tops of the boards (2) of the second layer a coating ung (6, 7) with a thermally conductive material. [2] 2. floor, ceiling or wall element according to claim 1, characterized in that the heat-conductive material contains graphite, preferably at least 50% by weight. [3] 3. floor, ceiling or wall element according to claim 2, characterized in that the heat-conducting material contains water glass, preferably soda-water glass. [4] 4. floor, ceiling or wall element according to claim 3, characterized in that the boards (2) of the second layer with the boards (1) of the first layer at all intersections between the boards (2) of the second layer and the boards ( 1) of the first layer are connected, preferably nailed or screwed. [5] 5. floor, ceiling or wall element according to one of claims 1 to 4, characterized in that the boards (1) of the first layer and / or the boards (2) of the second layer are made of wood, preferably are uncut. Bank details Österreichische Postsparkasse Account number, 92.111.622, BIS 60000 Swift-Code: OPSKATWW IBAN. AT55 6000 0000 9211 1622 Sparkasse der Stadt Feldkirch Account no. 0400-006300, bank code 20604 Swift code: SPFKAT2B IBAN AT70 2060 4004 0000 6300 T ϊ43 (0) 5522 73 137 F -43 (0) 5522 73 359 M orfice @ vpat. at I www.vpat.st VAT ATU 65652215 »* ······· I, Boden, floor, ceiling or wall element according to one of claims 1 to 5, characterized in that the boards (2) of the second layer at right angles to the boards (1) of the first layer. [6] 7. floor, ceiling or wall element according to one of claims 1 to 6, characterized in that the intermediate spaces (C) between the boards (1) of the first layer amount to at least 50mm. [7] 8. A heatable and / or coolable floor, ceiling or wall structure comprising a covering (10) forming the outer surface, floor or ceiling elements arranged below or inside thereof, which have accommodation spaces, and heating and / or cooling pipes (5), which are inserted into at least a part of the receiving spaces, characterized in that the floor, ceiling or wall elements are designed according to one of claims 1 to 7. [8] 9. floor, ceiling or wall structure according to claim 8, characterized in that the heating and / or cooling pipes (5) abut the intermediate spaces (4) between them enclosed coated narrow sides of the boards (2). [9] 10. floor, ceiling or wall structure according to claim 8 or 9, characterized in that the floor, ceiling or wall elements spans spaced support (12) to which they are attached, and form supporting parts of the construction.
类似技术:
公开号 | 公开日 | 专利标题 AT510499B1|2012-07-15|FLOOR, CEILING OR WALL ELEMENT DE102012001557A1|2013-08-01|Plate-type element for under-floor heating system for dry construction, has base plate containing specific percent of timber portion, and regularly-shaped cut-outs incorporated into cross-pattern plate for receiving tube by projections DE3209091C2|1986-08-07|Composite panel for underfloor heating CH685724A5|1995-09-15|Composite panel element for use as a cooling or Heizbauplattenelement. DE202004012708U1|2004-11-11|Holder for heating/cooling hoses for radiant heating systems, e.g. under floor heating consists of modular panel of wood fiber material with bonding agent, with channels for hoses, cover panel, and sound insulation EP1493973A2|2005-01-05|Device for holding temperature regulating elements, especially tubes CH617999A5|1980-06-30|Plate-shaped structural element for radiant heating systems EP0593984B1|1997-01-08|Wall element and wall made therefrom EP2703741A1|2014-03-05|Panel assembly and method for manufacturing same DE19801370A1|1998-10-29|Wall, ceiling, roof or other supporting component for building DE1966975A1|1975-12-18|Wall or floor panel for heating or cooling of rooms - has metallic sheet lining the inner surface of the panel nearest the room wall or floor EP2450636A2|2012-05-09|Floor lining carrier element and floor lining assembly with floor lining carrier element EP0005774A1|1979-12-12|Panel-like heating and/or cooling unit DE102005027495A1|2007-01-11|Structure for construction work has material forming intermediate energy store adjacent to cable DE102020112309A1|2021-11-11|Process for setting up underfloor heating, the same and intermediate product therefor DE2742429A1|1979-03-29|Flexible pipe mounting plate - is for heating or cooling pipes and consists of base plate with parallel rows of cylindrical projections DE102015003338A1|2016-09-15|Wood-concrete composite construction and method for its production DE3717577A1|1989-01-05|Heating panel DE102010015635B3|2011-11-17|Plant propagation table DE4433119A1|1995-03-23|Slab-shaped heat exchanger | EP0451619B1|1995-01-25|Method of manufacturing a composite polygonal panel for floors, panel made according to this method and a floor made from such panels DE2850196A1|1980-06-04|PRE-FABRIC FLOOR PANELS WITH HEATING CHANNELS FOR HEATING PIPES DE10138507A1|2002-08-29|Building facade of natural stone is composed of groups of thin stone plates, assembled in groups at a carrier layer, without gaps between them within groups but leaving open diffusion gaps at the joints between groups DE20116155U1|2002-03-07|Floor plate for underfloor heating DE102016012150A1|2018-04-19|wall construction
同族专利:
公开号 | 公开日 DE202011106315U1|2011-12-12| AT510499B1|2012-07-15|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题 DE3417162A1|1984-05-09|1985-11-14|Adolf Prof. Dr. 3220 Alfeld Knappwost|Process and heat-conducting element for increasing the heat conductivity of poorly heat-conducting masses| DE19647935A1|1996-11-20|1998-05-28|Heinrich Schuermann|Electrical interior heating for vehicles, trailers, containers and craft| DE19909391A1|1999-03-04|2000-09-07|Thermolutz Gmbh & Co Heizungst|Surface heating or cooling module comprizes dry-walled and roofing structures all without clad plate and with in-wall fluid lines laid in conducting sheets.| DE29916723U1|1999-09-23|1999-12-23|Wolf Roman|Module plate for electrical surface heating of floors or walls| DE10123892A1|2001-05-16|2002-11-21|Peter Moser|Dry-build heating element comprises conducting sheets fixed to wooden understrips and grooved to take endless pipe laid through several elements.| DE20110201U1|2001-06-19|2001-10-31|Reinhold Guenter|Drywall system for surface heating or cooling| DE20309683U1|2002-07-05|2003-11-20|Uponor Innovation Ab|Pipe locating system for a surface heating system, comprises a carrier plate with depressions in its upper surface for pipes| DE202009013100U1|2009-01-26|2010-03-25|Roth Werke Gmbh|Kit for a tempering device|CN108661276A|2018-01-04|2018-10-16|深圳东盟建材实业有限公司|A kind of cooling/heating dalle|DE10049172A1|2000-09-27|2002-04-11|Dietmar Hock|Construction plate has interlocking rebate along two opposite parallel edges with inner ledge, ramp and outer ledge with tongued and groove formation along ramps|DE202012004409U1|2012-04-27|2013-08-01|Sachsenkinder Regionalmarketing Gmbh|System board for the construction of heating and / or cooling surfaces in buildings| AT13787U1|2013-07-25|2014-08-15|Puchegger U Jilg Parkett Gross U Einzelhandels Ges M B H|floor construction| LU100746B1|2018-03-21|2019-10-01|Erwin Thoma|Activated wooden building elements and method for producing such building elements| US11084245B2|2019-01-09|2021-08-10|Six Minutes LLC|Cross-laminated timber having a conduit therein|
法律状态:
2021-06-15| MM01| Lapse because of not paying annual fees|Effective date: 20201008 |
优先权:
[返回顶部]
申请号 | 申请日 | 专利标题 ATA1681/2010A|AT510499B1|2010-10-08|2010-10-08|FLOOR, CEILING OR WALL ELEMENT|ATA1681/2010A| AT510499B1|2010-10-08|2010-10-08|FLOOR, CEILING OR WALL ELEMENT| DE202011106315U| DE202011106315U1|2010-10-08|2011-10-05|Floor, ceiling or wall element| 相关专利
Sulfonates, polymers, resist compositions and patterning process
Washing machine
Washing machine
Device for fixture finishing and tension adjusting of membrane
Structure for Equipping Band in a Plane Cathode Ray Tube
Process for preparation of 7 alpha-carboxyl 9, 11-epoxy steroids and intermediates useful therein an
国家/地区
|